Posts From Pradeep Chakraborty

Will ramp of FinFET manufacturing capacity shift market dynamics?

By : Pradeep Chakraborty

USA: Rolling out a new semiconductor technology always has its challenges, and it’s also usually accompanied by speculations and surprises. In 2011, at the 22nm process technology node, Intel surprised the semiconductor industry by introducing a three dimensional transistor structure,

Nitero achieves first-pass silicon success

By : Pradeep Chakraborty

MOUNTAIN VIEW, USA: Synopsys Inc. announced that Nitero achieved first-pass silicon success for its NT4600, the industry’s first 60GHz Wi-Fi system-on-chip (SoC) built for low-power mobile applications, using Synopsys’ DesignWare IP, Verification IP and the Galaxy Design Platform. Nitero integrated

Renesas intros ARM Cortex-A processor-based mbed microprocessor board

By : Pradeep Chakraborty

TOKYO, JAPAN: Renesas Electronics Corp. is simplifying embedded design for engineers and developers in the Maker space and working on emerging applications via the recently-launched ARM mbed IoT Device platform. Leveraging its RZ/A1 microprocessor, Renesas has developed the world’s first

ST and Autotalks ignite V2X communications

By : Pradeep Chakraborty

GENEVA, SWITZERLAND: As the drive to realize V2X — Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure communications — gathers pace, STMicroelectronics and Israel-based Autotalks, a V2X-chipset market pioneer and leader in the first wave of V2X deployments, are co-operating to deliver a mass

Mitsubishi Electric launches 12.1-inch WXGA 15-inch SXGA+ TFT-LCD modules

By : Pradeep Chakraborty

TOKYO, JAPAN: Mitsubishi Electric Corp. announced the launch of its new 12.1-inch WXGA, 15.0-inch SXGA+ TFT-LCD modules for industrial applications such as medical equipment, measuring instruments and ship/train instruments. The modules feature an unprecedented combination of super-wide 170-degree horizontal/vertical view angles,

Slight increase in Q3 2014 silicon wafer shipments

By : Pradeep Chakraborty

SAN JOSE, USA: Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Total silicon

Newark element14 launches full-featured SoC FPGA Lark Board

By : Pradeep Chakraborty

CHICAGO, USA: Newark element14 has announced the launch of the Lark Board, a high-performance development board based on Altera’s Cyclone V SoC. The Lark Board is designed for development of high-volume applications including automotive, medical equipment, video surveillance and industrial

Broadcom aims to be Amazon for IoT makers

By : Pradeep Chakraborty

IRVINE, USA: Broadcom Corp. announced the addition of more than 40 channel partners, optimized to serve the expanding Internet of Things (IoT) and high volume Ethernet IC markets. The company’s new scalable sales model provides the structure and broad ecosystem

Synopsys’ CODE V optimizes optical design performance for cost-effective manufacturing

By : Pradeep Chakraborty

MOUNTAIN VIEW, USA: Synopsys Inc. released the CODE V version 10.7 optical design software, the company’s industry-leading software application for the design of high-performance optical systems. The CODE V 10.7 release delivers expanded optimization, design visualization and analysis capabilities that

CodeMeter protection now available for Raspberry Pi

By : Pradeep Chakraborty

KARLSRUHE, GERMANY: The Raspberry Pi is often used in research and development as a cost-effective platform. To meet the demand of professional users, Wibu-Systems is announcing a Raspberry Pi version called “Compute Module” available for integration into pre-existing hardware. Wibu-Systems

FCI intros Griplet low profile and compact IDC terminal

By : Pradeep Chakraborty

SINGAPORE: FCI announced the release of the Griplet miniature IDC connector for wire-to-board terminations. FCI’s new Griplet connector offers a robust solution for miniature IDC Wire-to-Board connections. The low profile and compact design makes Griplet an ideal connector where space

3D TSV show slated for Jan. 2015

By : Pradeep Chakraborty

LYON, FRANCE: 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube, have all brought devices to the market that integrate

Xilinx announces SDAccel development environment

By : Pradeep Chakraborty

USA: Xilinx Inc. announced the SDAccel development environment for OpenCL, C, and C++, enabling up to 25X better performance/watt for data center application acceleration leveraging FPGAs. SDAccel, the newest member of the SDx family, combines the industry’s first architecturally optimizing

Global semiconductor market to grow 9.4 percent in 2014

By : Pradeep Chakraborty

EL SEGUNDO, USA: Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010. Global revenue in 2014 is expected to total

Newark element14 launches low cost Raspberry Pi A+ board

By : Pradeep Chakraborty

CHICAGO, USA: Newark element14 announced the exciting new Raspberry Pi Model A+ to compliment the range of boards available from Raspberry Pi. For only $20 the new model A+ features a 40-pin extended GPIO header, a Micro SD Card port

Security driving force behind smart home growth

By : Pradeep Chakraborty

USA: Within the Smart Home, Semico has been tracking over 70 items that every household can expect to purchase that will include some type of sensor and wireless chip by 2020. This new connected home includes white goods (clothes washer,

Applied Materials develops advanced patterning solution for memory devices

By : Pradeep Chakraborty

SANTA CLARA, USA: Applied Materials Inc. has collaborated with Samsung Electronics Co. Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Newark element14 launches MICROSTACK for Raspberry Pi

By : Pradeep Chakraborty

CHICAGO, USA: Newark element14 has launched the MICROSTACK range, a series of exclusive accessories for the Raspberry Pi that will make it quicker, simpler and easier for all levels of user to create and prototype physical devices for the next

FCI intros suite of solution for lighting apps

By : Pradeep Chakraborty

SINGAPORE: FCI, a leading supplier of connectors and interconnect systems, has introduced a comprehensive suite of solutions for Lighting applications. The FCI suite of products consisting of Wire-to-Board, Wire-to-Wire, Wire-to-Panel and Board-to-Board configurations, are suitable for a variety of lighting

Renesas eases safety, security, and connectivity for car of future

By : Pradeep Chakraborty

TOKYO, JAPAN: Renesas Electronics Corp. is easing the design complexities involved in developing self-driving car and other driver assistance systems that can offer users with a safe, secure, and convenient driving experience. The new RH850/P1x-C Series, a high-end version of