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World's lowest power MCUs now deliver big benefits in tiny packages

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Harmeet
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DALLAS, USA: Enabling developers to save valuable board space, Texas Instruments (TI) announced it has expanded the availability of tiny package sizes to several new families of ultra-low power MSP430™ microcontrollers (MCUs).

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Developers can now design smaller products with TI's ultra-low power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in addition to the five existing MSP430 MCU families with tiny package options.

Leverage tiny (WLCSP) package sizes on TI's ultra-low power MSP430 MCUs to optimize board space, reduce product size and save power.

These tiny package sizes make MSP430 MCUs ideal for a variety of ultra-low power applications such as sensor hubs, digital credit cards, ingestible sensors, health and fitness products like smart watches, and consumer electronics like tablets and notebooks.

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