UAT to double floor space at Malaysia facility

TAIPEI: Sources at Unisem (UAT), a wafer-bumping service provider, sat that the company has doubled the floor space of its plant in Ipoh, Malaysia, a development that is designed to increase capacity to three times its current level.

Sources say that UAT began cleanroom construction and equipment move-in at the new facility in June. The new capacity is expected to come on line in September this year.

The current upward trend in the industry has caused the company to have a huge rise in demand say company sources. As a result of this, UAT had to act quickly to step up bumping capacity and add floor space at the Malaysian facility.

UAT is a joint venture between Unisem, Advanpack Solutions and FlipChip International, and offers gold bumps, copper pillar bumps and solder bumps (through ball drop, plating and solder paste printing).