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TI introduces high-density power solutions

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CIOL Bureau
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BANGALORE, INDIA: Texas Instruments Incorporated (TI) today introduced two new power management integrated circuits for point-of-load designs that raise the bar for size, power density and performance.

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TI’s TPS82671 and TPS84620 integrated power solutions ease design and speed time-to-market in portable electronics, communications and industrial applications, said a press release.

“Point-of-load designs require greater power density, high efficiency and ease of use,” said Sami Kiriaki, senior vice president of TI’s Power Management business.

“These two new power devices achieve new levels of integration and performance, and allow us to support a wide range of customers in portable, telecom, base station and industrial markets like never before,” he added.

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TI said the TPS82671 is the industry’s smallest integrated plug-in power solution at 6.7 mm2, providing 90 milliamps per square millimeter. The device combines all external components in TI’s new MicroSiP package with a 1-mm height, easing design for 600-mA portable electronics, such as smartphones.

TI’s 6-A, 14.5-V TPS84620 achieves a power density of greater than 800 watts per cubic inch with up to 95 percent efficiency and 30 percent better thermal dissipation than competitors, the company claimed.

The integrated step-down solution combines the inductor and passives onto one device, and requires only three external components, resulting in a complete solution in a space less than 200 mm2, the release added.

TI said it offers the broadest range of power management ICs for non-isolated point-of-load designs, including step-up and step-down converters for portable and line-powered systems. These range from ultra-low power DC/DC converters with and without integrated FETs to fully integrated power solutions to plug-in power modules.

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