DALLAS : Texas Instruments Incorporated (TI) has announced
the availability of its Electronic Product Code (EPC) Generation 2 (Gen 2)
ultra-high frequency (UHF) silicon.
Offered in wafer and strap form factors, TI has
developed its Gen 2 silicon on the most advanced analog process node at 130
nanometer and with a built-in Schottky diode for more efficient conversion of
radio frequency (RF) signal energy. The result is silicon chips with low power
consumption and increased chip-to-reader sensitivity.
Users can also write to TI's chips under the lowest RF power conditions in spite
of background electromagnetic interference (EMI) common in typical supply chain
factory floor and warehouse environments.
Companies deploying UHF-based RFID systems based on TI's Gen 2 technology can
potentially capture a greater percentage of reads on cases and pallets as they
move through manufacturing and distribution channels.
With improved chip-to-reader sensitivity, companies can more accurately track
products and packages at all points throughout its supply chain operations and
improve process flow. TI's chip also delivers reliable read range performance
across both standard and dense reader mode operations.
Offering greater design flexibility to customers, TI is providing its Gen 2
silicon to inlay, label and packaging manufacturers in three convenient forms:
bare wafers to support various assembly processes; processed wafers (bumped,
sawn with back grind), suitable for immediate use with commercially available
inlay equipment; and silicon chip on straps for label and packaging
manufacturers who are printing their own antennas.
TI is also offering reference antenna designs enabling customers to develop
labels and tags which optimize its Gen 2 silicon.
TI's Gen 2 silicon is intended for use in the manufacture of passive RFID tag
products operating in the 860 to 960 MHz. frequency band. This chip also
supports "blockwrite" and "block erase" commands.
The government of India has de-licensed 865-867 MHz UHF band for RFID usage in
India, since March 2005, and there are approximately 50 system integrators and
designers of RFID solutions in India that can take advantage of TI's Gen 2
silicon.
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