SMIC forms Center for Vision, Sensors and 3DIC

SHANGHAI, CHINA: Semiconductor Manufacturing International Corp. announced the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D).

CVS3D consolidates and strengthens SMIC's R&D and manufacturing capabilities for silicon-based sensors, thru-silicon-via (TSV) technology and other middle-end wafer process (MEWP) technologies. MEWP technology has led to significant advancements in CMOS image sensors, MEMS sensors, 3D stacked devices, and high performance TSV-based 2.5D and 3D systems-in-package (SiP).

The semiconductor industry is rapidly adopting TSV-based 2.5D and 3DIC technology in order to further miniaturize system ICs while reducing power consumption and boosting device and system performance.

Market research forecasts global TSV wafer shipments to be around 1.35 million 12" wafers in Y2013, expanding to 9.58 million 12"wafers by Y2017, representing a 63 percent CAGR over the next five years.

In particular, by Y2017, close to 63 percent of wafer demand will be for Logic 3D SiP/SoC, MEMS Sensors, RF/Mixed Signal, and CIS-related ICs, all of which are essential for today's smartphone and mobile computing applications.

The formation of CVS3D is a strategic step in driving SMIC's technology differentiation strategy as SMIC expands its value-added technology offerings to a global customer base. One of our customers is already in production using CVS3D's technology offerings, a few customers have multiple additional products in qualification.