Si2 to sponsor '3D Architectures for Semiconductor Integration and Packaging Conference'

AUSTIN, USA: Silicon Integration Initiative (Si2) announced its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP). This conference will be held December 11-13, 2013, at the Hyatt Regency San Francisco Airport, Burlingame, California, and is organized by RTI International.

"Though 3D integrated circuits (3DICs) have been at the forefront of industry research and development for many years, there are still a number of technical and business challenges to solve before we see adoption in anything more than niche applications," says John Ellis, VP of engineering at Si2.

"However, 3DIC still holds the promise of an alternative path to Moore's Law for cost reduction, becoming ever more critical as financial returns on future technology-node investments become harder to attain. Technical issues, such as thermal management and testing, and business issues, such as cost reduction and sustainable 3DIC manufacturing business models, still must be solved.

"The development and implementation of the right industry standards, available at the right time, can go a long way towards mitigating risk and reducing cost. Fortunately, many organizations, including Si2, have been working the 3DIC standardization issue for some time. Si2 focuses on IC design flows and interoperability, and through our Open3D Technical Advisory Board, has been working on several 3D standards. These include a recently released Chip-Package Interface Protocol standard, and a Design Exchange Format for Thermal Management standard that is just is weeks away. "

Celebrating its tenth anniversary, 3D ASIP is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.