e-Shuttle, HKSTP silicon shuttle services

BANGALORE, INDIA: Hong Kong Science and Technology Parks Corp. (HKSTP), and Fujitsu Microelectronics Ltd's (FML) subsidiary e-Shuttle Inc. (ESI) in Japan have signed an agreement to provide silicon shuttle services for start-up integrated circuit (IC) design houses in Asia.

The initiative, boosting Asia’s semiconductor industry, provides first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost. The proprietary EBDW technology developed by e-Shuttle significantly lowers the cost of prototyping ICs and reduces turnaround time.

Under the new initiative, HKSTP will provide development support, including design tools and evaluation systems and secured remote access design environment to design houses, which then send timing, power and other data to ESI for prototyping using the EBDW technology. The IC designers evaluate the design or product prototypes from e-Shuttle for recommendation to manufacturers. This process will allow even small and medium-sized design organizations to leverage leading prototyping technologies such as 65nm at very low cost.

The program with e-Shuttle complements HKSTP’s IC Design Centre, which incorporates a wide range of IP services, including test development, IP trial, licensing, integration and verification, plus a legal framework for semiconductor intellectual property development under an ISO 27001 certified design environment.

e-Shuttle was established by Fujitsu Microelectronics Limited and Advantest Corporation to provide low-cost prototyping services for leading edge, large-scale ICs. It extends FML’s silicon shuttle operations with its proprietary EBDW technology.

“Our co-operation with e-Shuttle will enable us to provide small and medium-sized technology developers with access to the most advanced prototyping technologies and FML’s superior wafer manufacturing as well as a one-stop-shop service for design start and production release, governed by global best practices and the rule of IP protection laws of Hong Kong,” said Ir. S.W. Cheung, Hong Kong Science Park’s Vice President for Business Development and Technology Support.

The new partnership supports the rapid growth of Asia’s semiconductor industry, and the shift of IC design from the US and Europe to this region. According to e-Shuttle President Dr Haruo Tsuchikawa, "Working together with HKSTP we will activate new innovation by design houses in the semiconductor industry. HKSTP has the manufacturing support environment that start-ups need. Its secure information security system, together with our technology, is critical to leading-edge IC development."

“Prototyping advanced ICs is usually very costly, including the high cost of reticle lithography. EBDW technology provides a short delivery cycle at less cost with mask-less production,” continued Dr. Tsuchikawa.

“Since its establishment in 2001, HKSTP has been dedicated to IC and associated silicon IP development by forming strong alliances with key IT vendors, professional IC associations as well as leading universities,” said Cheung. “This co-operation with e-Shuttle further extends our technology portfolio network to Japan.”