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Sasken-TI to power low cost phones

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CIOL Bureau
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BANGALORE: Sasken Communication Technologies Limited has announced that its application framework ARIA has been successfully integrated on to Texas Instruments’s (TI's) "LoCosto" single-chip value platform.

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Sasken's application framework ARIA together with TI's "LoCosto" single chip will allow phone manufacturers to produce phones with affordable multimedia and compelling user experience while lowering the cost of integration and accelerating the time to market, a Sasken statement said.

Commenting on the partnership, Edwin Moses, VP sales and marketing, Sasken, said, "This close relationship has enabled us to deliver to customers an integrated and scalable feature phone solution with the application framework ARIA on TI's "LoCosto" platform. We believe that we are poised to replicate the successful relationship we've had with TI's OMAP platform with TI's "LoCosto" and OMAP-Vox solutions."

Remi El-Ouazzane, general manager of 2.5G Business, Wireless Terminals Business Unit, Texas Instruments, said, "Sasken's ARIA is an important addition to the portfolio of application suite partners on the "LoCosto" platform since it is a flexible architecture enabling fast customer differentiation and delivery. This flexibility coupled with Sasken's global support infrastructure makes Sasken an ideal application suite partner for "LoCosto" solutions."

ARIA is an application frameworks solution that is aimed at the feature phone market and for the first time enables customers to be able to create differentiated mobile phones without having to give up on software reuse and portability across phone designs and platforms. It simplifies the customers' ability to add and remove features in accordance with the segment of the market that they wish to address with their phones.

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