Samsung to up 8-inch wafer output

TAIPEI, TAIWAN: Attempting to live up to customer expectations and the increasing demand for high-end CMOS image sensors (CIS) from the handset sector, Samsung Electronics is lining up measures to spruce up its 8-inch wafers production.

The company is said to be ramping up out by 3,000-5,000 a month from August through December.

Besides, distributors in Taiwan have been quoted in a report as saying that the number of 5-megapixel CIS chips from each 8-inch wafer is only 700-800, which in fact is significantly lower than 1,800-2,000 1.3-megapixel chips. Samsung is therefore expected to put in more efforts toward output of 8-inch capacity to high-end CIS chips.

It is being understood that a range of high-end multimedia handsets are to be rolled out into the market during the second half of 2009. Handset giants of the likes of Nokia, Samsung and LG Electronics are all into 5-megapixel or above CIS.

This translates into added demand for 8-inch wafers. Samsung is believed to have an assured market in this space.

Samsung is believed to be processing more 8-inch wafers for CIS chips per month. It has set a target of a total capacity for the segment at 15,000-20,000 wafers by the year end. As per demand, the company will go in for adjustment of its capacity expansion plan at any time, sources added.