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Ricoh selects Cadence Palladium XP platform

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Sharath Kumar
New Update

SAN JOSE, USA: Cadence Design Systems Inc. announced that Ricoh Corporation selected the Cadence Palladium XP verification computing platform for its multifunction printer system-on-chip (SoC) development, after an extensive competitive benchmarking process. Achieving the fastest design "bring-up" compared to alternative solutions, the Palladium XP platform with Cadence PCIe 2.0 Accelerated Verification IP (VIP) also delivered a 40X verification speed-up over RTL logic simulation.

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"We chose the Palladium XP platform based on its superior technology, better value over alternative solutions and excellent technical support team," said Koichi Kamon, deputy division director of the Work Solutions Development Division at Ricoh. "The simulation acceleration bring-up time with the Palladium XP platform is by far the fastest and easiest in the industry, making it an easy choice for the SoC development of our state-of-the-art multifunction printer products."

"Ricoh is an important new Palladium XP customer for Cadence, and we are collaborating with its design team on the development and verification of their next-generation SoC," said Nimish Modi, senior VP, System and Software Realization Group at Cadence. "As the leader in system verification, Cadence is providing innovative solutions such as the simulation acceleration hot-swap technology between Palladium XP and Incisive Enterprise Simulator tools as part of an integrated flow for users needing higher performance and productivity."

Part of the Cadence System Development Suite, the Palladium XP platform is the industry's first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. With its hot-swap technology, the Palladium XP platform delivers unparalleled productivity as users can transition among simulation, simulation acceleration, and emulation environments at runtime without re-compilation. The Palladium XP platform offers systems and semiconductor companies flexible new use models that accelerate verification and hardware-software integration, helping to assure on-time delivery of high-quality products to the market.