Plasma-Therm announces cross-licensing agreement with ON Semiconductor

ST. PETERSBURG, USA: Plasma-Therm has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

The agreement includes cross licensing of technology that offers semiconductor manufacturers production solutions that accelerate the manufacture of next-generation devices.

"ON Semiconductor and Plasma-Therm co-developed a unique die singulation tool that utilizes a novel singulation approach patented by ON Semiconductor," said Dr. Hans Stork, ON Semiconductor senior VP and CTO. "Under the terms of our new agreement, Plasma-Therm can now

offer advanced die singulation equipment which utilizes ON Semiconductor's patented process technology."

The wafer singulation technology utilized in Plasma-Therm's recently released MDS-100 enables a significant reduction of kerf widths and addresses the limitations of saws and laser techniques for thin and ultra-thin silicon wafers.

ON Semiconductor is using the Plasma-Therm MDS-100 die singulation solution for production of its latest semiconductor devices. The benefit for a semiconductor manufacturer such as ON Semiconductor is higher yields and more active silicon per wafer.