Novellus launches suite of dry strip and clean systems

SAN JOSE, US: Novellus Systems announced two new industry-leading dry strip and clean systems, each targeting different photoresist removal requirements at fabs and foundries worldwide. The G400 and GxT are built upon Novellus' production-proven, market-leading GAMMA platform.

The tools address high throughput and low defectivity requirements for flash, DRAM and logic applications. Both systems have shipped to customers, with the first G400 going to a large Asian memory manufacturer and the GxT placed at multiple large foundries in Asia.

"With IC manufacturing becoming more complex, there is a clear need for specialized, dedicated tools like the G400 and GxT which have been optimized to meet diverging customer needs. Strip systems in cost-sensitive memory applications need to deliver the highest levels of productivity while providing the lowest cost of ownership. Logic applications, on the other hand, are driven by advanced technology requirements, with a need to deliver low silicon loss, ultra-low defectivity and critical clean applications," said Kevin Jennings, vice president and general manager of Novellus' Surface Integrity Group. "The introduction of these tools will further extend our leadership in the market for strip and clean systems."

G400: Targeting bulk strip and high-dose implant strip (HDIS) applications primarily used in large DRAM and flash memory fabs, the G400 is the industry's highest throughput ashing system. Enhanced source technology combined with faster wafer heating for higher ash rates enables the system to simultaneously deliver over 400 wafers per hour for bulk strip applications and 300 wafers per hour for implant strip applications. The G400 combines a new high-rate ashing technology with an optimized system design to provide up to a 25 percent productivity gain compared to prevailing industry standards.

GxT: Targeting critical logic processes that require low silicon loss and ultra-low defectivity, the GxT provides advanced capabilities for both demanding strip applications (including both HDIS and super-HDIS) and BEOL clean applications.

The GxT takes advantage of Novellus' production-proven multi-station sequential processing (MSSP) architecture, offering multiple process zones that provide the flexibility to handle complex recipes and chemistries. The system's SmartFlow gas distribution technology supports individual station-by-station control of both oxidizing and reducing chemistries.

Key to the system's success is its ability to support higher-temperature bulk applications, lower-temperature HDIS and advanced cleaning processes simultaneously on the same platform. These lower-temperature applications are integral to providing low silicon loss while ensuring high throughput with low cost of ownership.