New Electroplating system for WLP market debuts

SAN FRANCISCO, USA: Fab tool vendor Novellus Systems Inc. has rolled out a new electroplating system for the wafer-level packaging (WLP) market. The new system was revealed at the Semicon West trade show which took place in San Fransisco.

Based on Novellus’ current Sabre Electrofill tool, the new Sabre 3D is designed for a range of WLP processes, including copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping.

The new Sabre 3D includes several features, such as TurboCell technology for high rate electroplating, Advanced Pretreatment Technology (APT) for wetting, and XMM for overburden reduction.

APT ensures wetting and consistent fill initiation, which cam ensure that plating times can go up to 50 percent faster than systems that the competition offers say sources at the company. Novellus says that XMM technology, an in-line isotropic wet etch process, enables independent control of plated copper fill and overburden and reduces CMP cost of consumables by up to 70 percent.

According to the company, the new Sabre 3D platform takes advantage and incorporates 12 years of industry-leading electroplating technology and experience that Novellus possesses to create this tool that addresses the emerging requirements of the advanced WLP market.