JAPAN: Mitsubishi Electric Corp. announced the immediate launch of a transfer-molded super-mini dual in-line package power factor correction (DIPPFC) module.
It incorporates silicon carbide (SiC) transistors and diodes that is expected to help reduce the power consumption and size of home appliances.
Mitsubishi Electric's new DIPPFC module will be exhibited at MOTORTECH JAPAN 2014 during TECHNO-FRONTIER 2014, which will be held at Tokyo Big Sight in Japan from July 23 to 25.
Mitsubishi Electric's new full-SiC DIPPFC module is compliant with the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).
/ciol/media/agency_attachments/c0E28gS06GM3VmrXNw5G.png)
Follow Us