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ITRI lab to take 3D IC tech to greater heights

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CIOL Bureau
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TAIPEI: The TaiwaneseIndustrial Technology Research Institute (ITRI) has announced the establishmentof an experimental lab, which deploys 12-inch wafer through silicon via (TSV)process to develop Taiwan'snative 3D IC technology.

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The research Institute is supported by the governmentof Taiwan and the plan is to put in NT$1.6 billion (US$49.75 million) into itsdevelopment project for 3D IC technology over the span of the next four yearswith support from the Ministry of Economic Affairs (MOEA).

Sources say that ITRI also has plans to set up an R&Dteam comprising of 150 engineers who will specialize in integrated servicesranging from design to manufacturing to testing and packaging.

Apart from collaborating with equipment partners AppliedMaterials and Suss MicroTec, ITRI said it is working with members of theAdvanced Stacked-System Technology and Application Consortium (Ad-STAC) tojointly accelerate the development and commercialization of 3D chip technology.

The novelty of the package that ITRI provides is that ICsare stacked in a 3D structure which reduces the length of conducting wires andchip size. It is anticipated that this technology will replace the conventionalSoC, SiP solutions that are currently being used, which assemble ICs on a 2Dsurface.

The ITRI-led Ad-STAC now consists of 19 multinationalcompanies including Advanced Semiconductor Engineering (ASE), Cadence, SumitomoPrecision Products (SPP) and United Microelectronics Corporation (UMC).

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