Intel, Samsung Electronics, TSMC enter agreement

CIOL Bureau
Updated On
New Update

NEW DELHI, INDIA: Intel Corp, Samsung Electronics and TSMC have entered an agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.


The transition to larger wafers will enable continued growth of the semiconductor industry and help maintain a reasonable cost structure for future integrated circuit manufacturing and applications.

The companies will cooperate with the semiconductor industry to ensure that all the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

“There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth,” said Bob Bruck, VP and GM—Technology Manufacturing Engineering, Technology and Manufacturing Group, Intel.


“We, along with Samsung and TSMC, agree that the transition to 450mm wafers will follow the same pattern of delivering increased value to our customers,” he added.

Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline.

The companies also agree that a cooperative approach will help minimize risk and transition costs.


“The transition to 450mm wafers will benefit the entire ecosystem of the IC industry, and

Intel, Samsung, TSMC will work together with suppliers and other semiconductor manufacturers to actively develop 450mm capability,” said Cheong-Woo Byun, Senior VP, Memory Manufacturing Operation Center, Samsung Electronics.

“Increasing cost due to the complexity of advanced technology is a concern for the future. Intel, Samsung, and TSMC believe the transition to 450mm wafers is a potential solution to maintain a reasonable cost structure for the industry,” said Mark Liu, Senior VP—Advanced Technology Business, TSMC. 

The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.