Intel gets ready to make 450mm wafer

BANGALORE, INDIA: Chip giant Intel confirmed that it has plans to migrate its fabrication plants to a 450mm wafer size.

The company will start with the DX1 22nm plant in Oregon, which will be constructed to support both 300mm and 450mm wafer sizes side-by-side as the company prepares the plant to open in 2013.

Speaking to Electronista, Intel's Mark Bohr, director of process architecture and integration, said Intel is very interested in 450mm.

“'D1X is being (constructed) to be compatible with 450mm. I sense that some of the equipment vendors are interested in 450mm,” the report quoted him as saying.

However, for the time being, it will continue to manufacturer 300mm wafers as well.