Intel goes one-up on AMD with copper process

In a development that will dramatically impact microprocessor speeds during

the next two years, Intel announced its engineers have completed development of

an advanced new 0.13 micron, copper-based manufacturing process. The new process

helps in increasing the number transistors per chip, shrink transistor size, and

boost processing speed while producing less heat.

The new process will result in substantial performance gains over current

0.25 and 0.18 production processes. The first 0.13 micron chips, to be produced

initially at a fab in Oregon, will hit the market in 2001 and will immediately

boost performance of existing chips by about 20 per cent. Eight other Intel

microprocessor fabs will be upgraded to the new process throughout 2001 and

2002.

"We have achieved a very important milestone," said manager of the

technology and manufacturing group Sunlin Chou. "This process contains

quite a few simultaneous technology advancements, more so than our average

improvement."

The new production process was particularly tricky as Intel was trying to

adopt both a major reduction in component geometry, from 0.18 to 0.13 micron,

and also use new copper-based interconnect technology, a radical departure from

the aluminum wires used in ICs for the past 25 years.

Usually, chipmakers will focus on just one major technology change in their

next-generation production process. Two major changes is simply considered too

risky. Intel, however, had little choice. The move to 0.13 has been on the time

table for some time. But the chipmaker also needed to catch up with Advanced

Micro Devices on the use of copper technology. The latter has helped AMD keep

up, and sometimes, be ahead of Intel in the processor performance race.