Intel CEO outlines new computing opportunities with China technology ecosystem

SHENZHEN, CHINA: As the computing industry landscape undergoes rapid transformation, Intel Corporation CEO Brian Krzanich today outlined the company's plans to build upon its nearly 30-year history in China, and collaborate with the growing technology ecosystem, particularly in Shenzhen, to accelerate new innovation and reshape the computing industry.

During his keynote, Krzanich discussed how Intel and the Shenzhen technology ecosystem can re-ignite growth - both locally and globally - and deliver differentiated computing products and experiences, spanning multiple market segments, operating systems and price points.

Investing in Innovation in China

Building on the company's history of enabling and collaborating with customers to deliver innovative platforms, Intel will establish the Intel Smart Device Innovation Center in Shenzhen to accelerate the delivery of Intel technology-based devices to the China market and beyond.

The center will expand Intel's work beyond tablets and provide local OEMs, ODMs, and software developers with access to Intel technology platforms and enabling support, including master reference designs for turnkey solutions, development tools, supply chain sourcing, quality management and customer support - acting as a bridge between product conception and commercial deployment.

Further accelerating this effort, Krzanich announced the US$100 million Intel Capital China Smart Device Innovation Fund focused on accelerating innovation of smart devices, including 2-in-1s, tablets, smartphones, wearables, IoT and other related technologies in China.

Velocity in Mobile Devices

As 4G LTE service expands in China, Intel is well-positioned to provide a growing share of LTE chipsets. Intel's 2014 LTE platform, the Intel XMM 7260, meets the five-mode requirement of China Mobile today, including support for TD-LTE, and TD-SCDMA protocols required in China.

Intel is actively engaged in China for certification of the XMM 7260, paving the way for commercial availability in the second half of 2014 for performance and mainstream device market segments.

Intel is also developing its SoFIA family of integrated mobile SoCs for entry and value smartphones and tablets. Intel's SoFIA 3G platform is on track to ship to OEMs in the fourth-quarter of 2014.

Krzanich also said that Intel is on track to ship 40 million tablets this year, and showcased a variety of innovative designs developed in China by OEMs and ODMs.

Enabling the Growing Internet of Things

Intel is actively pursuing a range of solutions, from the edge device to the cloud, to address the growing opportunities presented by IoT.

Krzanich announced availability of the Intel Gateway Solutions for IoT, an integrated solution based on Intel Quark and Atom processors, in addition to an Intel Galileo-based development platform. These platforms will help businesses reduce costs and offer new services by unlocking valuable data from legacy systems that traditionally haven't had a means to communicate with each other and the cloud.

The first platforms integrate Wind River and McAfee software to help accelerate time to market and will be available from the ecosystem this quarter. Customers developing gateway solutions include Shaspa for energy and building automation, RocKontrol for energy management, TransWiseway and Vnomics for transportation, and Zebra Technologies Corp for locating solutions in retail, healthcare and manufacturing.

Turning to other smart, connected devices that help make up the IoT, Krzanich said Intel Edison is on track for availability later this summer.