Intel builds Centrino awareness

BANGALORE: As part of its GID training program, Intel plans to educate notebook assemblers to build solutions based on Centrino mobile technology. According to the company, this initiative will compliment Intel´s plans to promote notebooks to masses with built-in wireless capabilities.

"We plan to provide systems integrators with building blocks to assemble notebooks on Centrino environment," said GB Kumar, GM-Internet Solutions Group, Intel Asia. According to him, Intel´s first step towards building a strong SI network for Centrino notebooks would be to train assemblers.

The proposed training for assemblers would include programs which would enable them to understand the design and the working of Intel M processor along with 855 chipset and Intel prowireless 2100 network connectivity. "With the demand of mobility increasing, this new processor with wireless capability will allow users to get connected to any "hot spot" with Wireless Fidelity (Wi-Fi) facility," said Kumar.

Intel also sees the SI segment to be the driving force to catalyze the Centrino mobile technology and Wi-Fi environment in the country. "We are also planning to work closely with SI and NI partners to popularize Wi-Fi environment and Centrino technology in the country," he added. According to him, Intel has not rolled any specific programs for SIs and NIs yet, but is planning to do so shortly.

Currently Intel runs "seeding program" targeted at end users. This program educates them with the advantages of using Centrino mobile technology. According to Kumar, Intel will roll out a special program targeted at SIs and NIs on similar lines, which will help them identify the growth opportunities in the Wi-Fi space.