Indium technology experts to present at Southeast Asia Technical Conference

MALAYSIA: Indium Corp.'s Dr. Ning-Cheng Lee, VP of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.

Dr. Lee will teach two professional development courses. His first course, Electromigration - the Hurdle for Miniaturization and High Power Devices, examines the electromigration phenomenon in miniaturized electronics, including the effect of current density and temperature, the path through Al and Cu solder, the effect of solder grain orientation, composition, volume, the resistance of solder joints, and more.

Dr. Lee's second course, Achieving High Reliability of Lead-Free Soldering - Materials Consideration, talks about materials considerations required for achieving high-reliability lead-free solder joints. Emphasis is placed on understanding how various factors contribute to failure modes and how to select the proper solder alloys and surface finishes to achieve high-reliability.

Sze Pei will present Reliability of BGA Assemblies with SAC and 57Bi42Sn1Ag Alloys. Her presentation explores replacing SAC solders with BiSnAg as a low-cost solution. The joint mechanical strength, drop test performance, and voiding performance of these alloys were evaluated against their reflow profile.

Sehar will present The Second Generation Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn. This presentation discusses the considerable improvement in shock resistance and thermal fatigue performance of a new solder alloy doped with Mn.