IDT to transfer production at Oregon fab

OREGON, CANADA: Toeing the line of memory makers across the globe, Integrated Device Technology Inc (IDT) is looking at following suit and move towards a fabless model.

The company has decided to close down its last remaining fab in Oregon and transfer the production to Taiwan Semiconductor Manufacturing Co Ltd (TSMC).

The decision has come about following the company’s efforts to snip costs. A foundry agreement entered into by IDT and TSMC will help transfer product fabrication processes and related activities currently running in IDT's Oregon fab to TSMC's plants, said an EE Times report.

It added that the deal also envisages transfer of product processes as well as geometries, and also would include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro at 0.13-micron process technology and above. It is expected that the processes and products will be transferred to TSMC over the next two years.

However, the agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro. It has already been reported that IDT is looking at exiting its Hillsboro wafer fabrication facility at the end of the transfer period and has engaged a third-party to market the facility to potential buyers that can continue fabrication operations.

On the manpower front, the companies have said that there are no plans for layoffs at the fab as at present.