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Focus on technology challenges at SEMICON Japan 2014

power devices, DFM, lithography, MEMS, packaging, test, Japan, SEMI, Semiconductor Equipment Association of Japan, semiconductor equipment market

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Pradeep Chakraborty
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TOKYO, JAPAN: Presentations by Accenture Japan, Scripps, Toyota and ARM, were recently announced for SEMICON Japan 2014, which was held at the Tokyo Big Sight in Tokyo on December 3-5, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

Opening day presentations included: Makiko Eda (CEO of Intel K.K.), Chikatomo Hodo (president of Accenture Japan), Donald Jones (chief digital officer of Scripps), Tokuhisa Nomura (executive GM at Toyota), Yuzuru Utsumi (president of ARM K.K.), and Yasuo Naruke (CEO of Toshiba).

There were sessions on power devices, DFM, lithography, MEMS, packaging, test, and more. Bringing the latest in technology and opportunities for the semiconductor industry and to the new World of IoT (Internet of Things), SEMICON Japan offers a comprehensive look at what is going on in the industry.

The semiconductor equipment market in Japan is forecast to grow both in 2014 and 2015. Drivers for the increased investment are: memory devices, power semiconductors and “More than Moore” semiconductor technologies. According to the SEMI World Fab Forecast, in 2014, Japan will spend more than $10 billion in 2014 on semiconductor equipment and materials. The projection for 2015 is to more than double semiconductor equipment spending to $4.2 billion.

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