Ericsson, TI to build soln for 3G devices

CIOL Bureau
New Update

NEW DELHI, INDIA: Ericsson and Texas Instruments Incorporated (TI) have formed a strategic technology agreement to develop custom solutions for new Open OS enabled 3G devices.


Solutions from the technology created by the two companies will combine small and power efficient 3G modems from Ericsson Mobile Platforms with high-performance OMAP applications processors from TI. Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies and will be capable of supporting Open OS, which offer easy access to a rich array of applications and services.

The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range market, Ericsson said in a statement.

Greg Delagi, senior vice president of TI's Wireless Terminals Business Unit, said, "TI's broad, proven product portfolio and advanced manufacturing capabilities have continued to adjust to the demanding requirements of EMP's customer base. We believe that today's announcement will build on what TI can bring to EMP and what both companies together can bring to this vital, dynamic industry."

By leveraging TI's OMAP platform with Open OS support for Windows Mobile, Symbian S60, Symbian UIQ and Linux, these solutions will provide OEMs and operators with a robust and flexible architecture for applications and services deployment, enabling easier delivery and management of services and content. This enables handset manufacturers and mobile operators to differentiate their products through rich, easy-to-use and customizable user interfaces, and through a robust and flexible application architecture.

Handsets based on these solutions are expected to be available on the market in the second half of 2008