EMC growth momentum to reach $1,702 million by 2017

DUBLIN, IRELAND: Research and Markets has announced the addition of the "Opportunities of EMC in Global Semiconductor Packaging Industry: 2012-2017 Trends, Forecast and Opportunity Analysis" report to its offering.

The epoxy molding compound (EMC) market in the semiconductor packaging industry has witnessed growth over the last five years. Numerous factors influence the EMC market in the semiconductor packaging industry.

This research indicates that the industry has displayed cyclical behavior: During the upturn years, the generated profits are used to sustain operations during economic downturns. During upturn periods, however, investment is greater than demand, due to which growth is slow for a longer period during the downturn and the poor performers struggle.

The companies holding greater market share are creating higher profits because they have closer relationships with key customers and possess better research and development processes that yield better innovations and a greater ability to maintain profit during downturns.

The composition for epoxy molding compound for encapsulation of semiconductors are epoxy resins, fused silica, coupling agent, hardener, flame retardants, curing promoters, release agent, and low stress additives. Previously, bisphenol-A was used as the epoxy resin; epoxy cresol novolac is now preferred over bisphenol-A because of better resistance to heat. Epoxy resin is preferred to produce EMC due to its unique attributes.

In EMCs, the filler represents up to 75 percent by weight. Fillers provide mechanical strength to the EMC and reduce the thermal expansion coefficient, which reduces the shrinkage after molding.