Dow Electronic Materials' Japanese JV honored with 2014 Toshiba supplier award

PHILADELPHIA, USA: Dow Electronic Materials, a business unit of The Dow Chemical Co., announced that its Japanese joint venture Nitta Haas Inc. has been recognized with a 2014 Partnership Award from Toshiba Semiconductor & Storage Products Co. from its Yokkaichi Operations.

Nitta Haas received this award for identifying solutions that simplified both the CMP pad inspection and pad testing process, thereby improving the productivity of its IC1000 polishing pads. These enhancements contributed to reduced cost of ownership (COO) for Toshiba.

"We are honored to receive this award, which recognizes our on-going efforts to support our customers' business," said Dr. Masaharu Kinoshita, president, Nitta Haas Inc. "It reflects positively on the results of our close collaboration with our customers and demonstrates the value of the products and services we provide. The award also highlights our value analysis activities, which significantly enhanced our ability to improve COO and deliver better solutions."

The award recognized Nitta Haas' value analysis activities, which contributed to the company receiving this strong customer recognition. Toshiba presented the award to Nitta Haas in a ceremony that took place in January.

Dow and Nitta Haas serve the semiconductor and related industries with leading edge technology that supports the advancement of device shrinks and increased power for semiconductor devices. For CMP, the company offers materials for planarizing and polishing semiconductors, silicon wafers and storage media including hard and soft pads and unique slurries.