DEK platform intelligence, new stencil technology @ NEPCON South China 2013

GERMANY: At NEPCON South China, set to take place from 27-29 August in Shenzhen, China, top print technology provider DEK will illustrate how the advanced capability of its print platforms and powerful process support products, combined with the unmatched process expertise of its staff, can enable accurate, high-yield electronics assembly and semiconductor manufacturing.

From stand A-1J35, DEK will showcase its advanced process support tools -- such as stencils, fabrics and chemistries - that are essential to a good print. Visitors to the DEK stand can get a first-hand look at the company's latest stencil innovation, VectorGuard High Tension, which unites process flexibility and fine-pitch print capability.

Building on the award-winning, single frame VectorGuard stencil technology, VectorGuard High Tension delivers the same benefits of process adaptability and operator safety, but in a higher tension version. In fact, VectorGuard High Tension offers consistent tension of over 40 Newton, thereby enabling better transfer efficiency and print definition for leading-edge, miniaturized components and providing greater process control over the life of the stencil. Show delegates are invited to see live demonstrations of VectorGuard High Tension and compare the tension difference for themselves.

During the three-day exhibition, DEK will also highlight two of its print platforms, the value-driven Horizon 03iX and the brand new Horizon 9. Prioritizing machine intelligence, limiting operator intervention and providing maximum flexibility, the Horizon 03iX system will host sophisticated features such as ProDEK and ProActiv. ProDEK, which will be shown on board the Horizon 03iX alongside a Parmi SPI system, is a dynamic closed loop print technology that provides on-the-fly print offset correction and automatic understencil cleaning frequency adjustments to maximize yield and throughput.

Used in conjunction with ProActiv's transfer efficiency power, ProDEK enables true, machine-based process intelligence for today's highly miniaturized assemblies. The Horizon 9 platform, which can be customized with the most advanced capabilities, will be fitted with DEK-developed technologies such as Virtual Panel Tooling (VPT), Automatic Paste Dispense, and Cyclone understencil cleaning, all designed to deliver maximum capability for SMT processes, as well as the extreme accuracy required for semiconductor applications.

"The demands of modern assembly and semiconductor manufacturing environments require intelligent technologies," notes Allen Huang, DEK GM of Greater China. "With decreasing pitches and higher component densities, the printing process is more complex than ever before. To achieve exceptional yields, machines must be able to print fine-pitch deposits, analyze and then adjust independent of operator intervention. DEK understands this reality and it has been our driving force for platform and support product development for many years."

DEK's approach to print process optimization is holistic, incorporating not just advanced systems and technologies but the unrivalled expertise of its people. Illustrating the solutions consistently delivered by its knowledgeable team, the DEK display at NEPCON South China will feature the DEK Solutions Center. Manned by DEK print technology experts, the Solutions Center is a place where assembly and semiconductor specialists can bring their challenges and ideas for a free, in-depth consultation with a member of the DEK team.

"We take our role as a total solutions provider very seriously," says Huang. "From intelligent platforms to state-of-the art process support products to, most importantly, a highly experienced team, DEK delivers a comprehensive approach for print process success."