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Collaboration to address challenges in SoCs

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CIOL Bureau
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SEOUL, S.KOREA: An agreement aimed at developing a comprehensive technology enablement solution for the design and manufacture of mobile Internet-optimized devices has been given shape.

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The deal made public at the Design Automation Conference (DAC) has been jointly signed by ARM, Chartered Semiconductor Manufacturing Ltd, IBM, Samsung Electronics Co Ltd and Synopsys, Inc. It is expected that the new deal would address fundamental challenges in creating advanced systems-on-chips (SoCs).

Besides, the collaboration would also aim at leveraging innovations in material science, mobile multimedia implementation and SoC design to lower risk and improve time-to-market for advanced mobile products, said industry sources.

As per the agreement, the collaboration of technology would involve the integration of ARM’s high-performance, low-power processor architecture for mobile applications, and optimized suite of physical intellectual property, the 32/28-nanometer (nm) low-power/low-leakage, high-k metal-gate (HKMG) synchronized foundry services through the Common Platform manufacturing alliance of IBM, Chartered and Samsung, Synopsys’ Lynx Design System, including Galaxy Implementation Platform for SoC implementation, as well as DesignWare connectivity IP.

This agreement is being foreseen as bringing in a new level of collaboration necessary to address the cost and technical challenges associated with advanced SoC design and manufacturing.

Further, the deal would also help in aligning strategy, technology roadmaps and customer deliveries, an industry news source added. It has also been pointed out that each of the company would bring in the unique technology and expertise, which collaborate to create an optimized solution.

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