Ceva's joint initiative with Infineon

SAN FRANCISCO, USA: IP licensor Ceva Inc has licensed its dual MAC, 32-bit Ceva-TeakLite-III DSP core to Infineon Technologies AG  in a bid to bring in better performance in mobile phones and modern platforms. The joint initiative between the two companies is expected to help generate more features in advanced technologies.

By offering the latest generation Ceva-TeakLite-III DSP architecture, Infineon will be able to improve its processing performances and this is expected to be done by maintaining the code compatibility with the existing the Ceva-Infineon architectures.

Gideon Wertheizer, CEO of Ceva, was quoted in a statement as saying that Ceva TeakLite-III DSP would enable Infineon improve future wireless and multimedia processor designs. Also, the DSP would play a vital role in the overall performance and power consumption of  handsets.

With many of the world's leading handsets across the globe incorporated with DSP core technology, the Ceva powered phone range from ultra low cost devices to smart phones and about 700 million Ceva-powered handsets have already shipped worldwide. Ceva believes that DSP cores power many of the world's leading handsets today, with all top five handset OEMs shipping Ceva-powered phones.