CEVA addresses next trends in mobile, digital home and automotive at CES 2014

MOUNTAIN VIEW, USA: CEVA Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will showcase a range of comprehensive platform IP solutions at CES 2014 designed to enable the next technology trends in the mobile, digital home and automotive markets.

At the show, taking place in Las Vegas from January 7-10th, CEVA will host a private meeting suite in the Las Vegas Hotel where invitees can interact with the demonstrations and meet with CEVA engineers, partners and members of the executive team.

CEVA's platform IP solutions allow customers to simplify their SoC design effort and significantly reduce both the power consumption and cost of implementing the most advanced technology requirements across a broad range of end markets. These solutions include:

* The industry's most advanced and lowest power computational photography and embedded vision platform IP designed to enable true product differentiation to any camera-enabled device, including all-in-focus imaging, smart zoom, multi-exposure, object recognition, gesture recognition, image stabilization and much more.

* The industry's first universal communications platform IP, addressing LTE, LTE-Advanced, Wi-Fi, satellite communications, DTV demodulation, wired access and much more. The platform is scalable to meet any design requirements, from the Internet of Things (IoT) through smartphones and tablets to Wi-Fi access points and base stations.

* The industry's lowest power platform IP for advanced voice and audio applications, offering extended battery life and enhanced feature sets such as always-listening voice trigger, noise reduction, speaker protection, and high-resolution audio.