Cadence licenses Tensilica ConnX BBE16 DSP to GCT

SAN JOSE, USA: Cadence Design Systems Inc. announced that GCT Semiconductor Inc. licensed the Cadence Tensilica ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications.

The Tensilica DSP core offers high computation throughput in a small and very low power footprint, coupled with its extensive DSP core roadmap to meet future device computation requirements.

"Using programmability to implement 4G and multi-standard baseband modem functionality can accelerate time-to-market," said Alex Sum, VP of sales and marketing at GCT Semiconductor. "We are pleased to be working with Cadence to further advance our LTE chipsets. Using the Tensilica ConnX BBE16 DSP core allows chip makers to develop a product that meets the cost and power requirements. It also facilitates a tight integration of existing hardware blocks and the flexibility to tune the modem via software."

The Tensilica ConnX BBE16 DSP core is a very efficient 16-MAC (multiply-accumulate) DSP core that has been optimized for OFDM-based wireless communication modem. It is fully programmable in C, eliminating the need for assembly coding found in other DSPs and also enables easier software development and maintenance.