Broadcom combo chip, s/w Bluetooth v3.0 and HS compliant

IRVINE, USA: Broadcom Corp. has announced that its leading Bluetooth combo chip technology and associated BTE software have been qualified as compliant with the ratified Bluetooth v3.0 + HS (high speed) specification.

The new standard significantly expands the capabilities of Bluetooth wireless technology in multimedia smartphones, netbooks and other devices by enabling the transmission of large files via Bluetooth profiles at speeds up to 24 Megabits per second (Mbps), or a 10 times increase in speed over the previous Bluetooth v2.1 + EDR (enhanced data rate) standard.

With the company's InConcert(R) BCM4325 Bluetooth + Wi-Fi(R) + FM combo chip solution (the first product in the industry to achieve qualification) and Bluetooth software, Broadcom is uniquely positioned to support the latest Bluetooth specification with proven single-chip solutions.

While competing implementations require multiple discrete components that raise cost and power requirements, Broadcom is able to provide a single-chip solution that includes both a qualified Bluetooth v3.0 BR/EDR (basic rate) controller and Wi-Fi CERTIFIED media access controller (MAC)/physical layer (PHY) device.

When combined with Broadcom's v3.0 + HS qualified host software solution, these products enable OEMs to add the convenience of high speed Bluetooth data transfer while reducing board space, power consumption and overall system cost in next generation Bluetooth-enabled devices.

Broadcom's high speed Bluetooth technology was demonstrated at the 2009 International Consumer Electronics Show in Las Vegas. The Bluetooth Special Interest Group (SIG) announced the formal adoption of its next generation Bluetooth v3.0 + HS wireless connectivity technology on April 21, 2009, at the SIG Annual All-Hands meeting in Tokyo.