MUNICH: Infineon Technologies today announced sample availability of its latest baseband processor for multimedia mobile phones of the 3.5 generation.
In addition to the existing platform solutions, Infineon now supports all of the world's major mobile phone standards and can address all market segments. The 3.5G base-band processor S-GOLD3H provides data rates of up to 7.2 Megabit per second and represents the world's first chip for the mid-range multimedia phone segment with such high data rates.
“For the last fifty years the mantra of the semiconductor industry was “shrink, shrink, shrink”,” said Prof. Dr. Hermann Eul, member of the board and head of the Communication Solutions business group of Infineon. “Now we have entered the area of “innovative integration” by combining leading-edge and proven technologies, functions and features on the smallest possible piece of silicon. While using established and well known processes, we will be offering breakthrough solutions for the demand driver in our industry.”
The S-GOLD3H is the heart of Infineon's next generation mobile multimedia platform, which it calls the MP-EH, supporting HSDPA (High-Speed Downlink Packet Access) data rates of up to 7.2 megabits per second (Mbit/s). Other components of the MP-EH are a power management chip SM-Power3; a RF transceiver SMARTi 3GE; a six-band WCDMA and quad-band EDGE RF transceiver; a “Bluemoon UniCellular” chip for Bluetooth connectivity; an A-GPS (Assisted GPS) positioning single-chip “Hammer- head”; as well as a WLAN low power chip called “Wildcard LP”.
The S-GOLD3H sup-ports GSM, EDGE, GPRS and WCDMA mobile phone networks. Innovative design by Infineon successfully integrated high quality video capabilities into the S-GOLD3H, which makes application processors or companion chips obsolete in most cases.