Altera and TSMC to bring advanced packaging technology to Arria 10 FPGAs and SoCs

HONG KONG & HSINCHU, TAIWAN: Altera Corp. and TSMC announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera's 20 nm device family.

"TSMC has provided a very advanced and robust integrated package solution for our Arria 10 devices, the highest-density monolithic 20 nm FPGA die in the industry," said Bill Mazotti, VP of worldwide operations and engineering at Altera. "Leveraging this technology is a great complement to Arria 10 FPGAs and SoCs and helps us address the packaging challenges at the 20 nm node."