Archive

3D TSV show slated for Jan. 2015

By : Pradeep Chakraborty

LYON, FRANCE: 3D TSV integration has already been adopted in MEMS and CMOS Image Sensors for consumer applications. Device makers such as Sony, Toshiba, Omnivision, Samsung, Bosch Sensortec, STMicroelectronics and mCube, have all brought devices to the market that integrate

Xilinx announces SDAccel development environment

By : Pradeep Chakraborty

USA: Xilinx Inc. announced the SDAccel development environment for OpenCL, C, and C++, enabling up to 25X better performance/watt for data center application acceleration leveraging FPGAs. SDAccel, the newest member of the SDx family, combines the industry’s first architecturally optimizing

Global semiconductor market to grow 9.4 percent in 2014

By : Pradeep Chakraborty

EL SEGUNDO, USA: Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010. Global revenue in 2014 is expected to total

Newark element14 launches low cost Raspberry Pi A+ board

By : Pradeep Chakraborty

CHICAGO, USA: Newark element14 announced the exciting new Raspberry Pi Model A+ to compliment the range of boards available from Raspberry Pi. For only $20 the new model A+ features a 40-pin extended GPIO header, a Micro SD Card port

Security driving force behind smart home growth

By : Pradeep Chakraborty

USA: Within the Smart Home, Semico has been tracking over 70 items that every household can expect to purchase that will include some type of sensor and wireless chip by 2020. This new connected home includes white goods (clothes washer,

Applied Materials develops advanced patterning solution for memory devices

By : Pradeep Chakraborty

SANTA CLARA, USA: Applied Materials Inc. has collaborated with Samsung Electronics Co. Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Newark element14 launches MICROSTACK for Raspberry Pi

By : Pradeep Chakraborty

CHICAGO, USA: Newark element14 has launched the MICROSTACK range, a series of exclusive accessories for the Raspberry Pi that will make it quicker, simpler and easier for all levels of user to create and prototype physical devices for the next

FCI intros suite of solution for lighting apps

By : Pradeep Chakraborty

SINGAPORE: FCI, a leading supplier of connectors and interconnect systems, has introduced a comprehensive suite of solutions for Lighting applications. The FCI suite of products consisting of Wire-to-Board, Wire-to-Wire, Wire-to-Panel and Board-to-Board configurations, are suitable for a variety of lighting

Renesas eases safety, security, and connectivity for car of future

By : Pradeep Chakraborty

TOKYO, JAPAN: Renesas Electronics Corp. is easing the design complexities involved in developing self-driving car and other driver assistance systems that can offer users with a safe, secure, and convenient driving experience. The new RH850/P1x-C Series, a high-end version of

Energy-measurement analog front ends for single-phase smart meters and power monitoring

By : Pradeep Chakraborty

USA: Microchip Technology Inc. has announced the completion of its high-accuracy, 1-8 channel, single and poly-phase MCP391X energy-measurement Analog Front End (AFE) family. The new MCP3919 and MCP3912 members integrate three and four channels of 24-bit, delta-sigma Analog-to-Digital Conversion (ADC),

Focus on technology challenges at SEMICON Japan 2014

By : Pradeep Chakraborty

TOKYO, JAPAN: Presentations by Accenture Japan, Scripps, Toyota and ARM, were recently announced for SEMICON Japan 2014, which was held at the Tokyo Big Sight in Tokyo on December 3-5, the largest exhibition in Japan for semiconductor manufacturing and related processing

Air Products needs to keep its electronics business, but…

By : Pradeep Chakraborty

Dr. Robert N. Castellano NEW TRIPOLI, USA: I only live a few miles from Air Product’s corporate headquarters, and have been analyzing its semiconductor and electronics business since 1985, when I started The Information Network. At that time, a couple

Videocon launches Dual SIM smartphone at Rs. 4,999

NEW DELHI, INDIA: Videocon group has introduced another device to the Nova series, Infinium Z45 Nova. The device is exclusively available on Flipkart at a price of Rs. 4,999. The Infinium Z45 Nova is encased within a slim profile of just

CES 2015 will feature the latest innovations in IoT

USA: The 2015 International CES will feature the largest ever showcase of products, services and technologies that make up the “Internet of Things” (IoT), with more than 900 exhibitors planning to share innovations that harness the power of the network to connect

Sandbox Startups Incubator program to help startups accelerate growth

HUBLI, INDIA: Deshpande Foundation’s Sandbox Startups Incubator has announced the opening of applications for the Incubation Program. Designed in association with Microsoft Ventures the program will help accelerate growth for tier-2 and tier-3 cities based startups in the social and

New areas of InfoSecurity risks tops among 2015 predictions

MUMBAI, INDIA: ESET, has compiled and published a summary of the top cybercrime trends and predictions for 2015. While last year’s focus was on internet privacy and Android malware, new areas of InfoSecurity risks are bubbling to the top in 2015.

Link-U hybrid IP camera doubles as smart home hub

By : Pradeep Chakraborty

SAN JOSE, USA: Using a simple to install, affordable IP camera as a hub for your connected home? Now, that’s smart. More and more people are embracing the idea of remotely controlling or programming an array of automated home electronic

Tango Systems achieves conformal deposition for 15:1 aspect ratio TSVs

By : Pradeep Chakraborty

SAN JOSE, USA: Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a15:1 aspect ratio. This significant achievement represents the

Synopsys Virtual Prototyping book achieves huge milestone

By : Pradeep Chakraborty

MOUNTAIN VIEW, USA: Synopsys Inc. has distributed more than 3,000 copies of the Better Software. Faster! book on virtual prototyping to over 1,000 companies. The fast adoption of the book demonstrates how the industry is increasingly looking to virtual prototyping

Altera and MathWorks deliver unified model-based design workflow for Altera SoCs

By : Pradeep Chakraborty

SAN JOSE, USA: Altera Corp. announced new programming support for its ARM-based SoCs using industry-standard workflows from MathWorks. Release 2014b from MathWorks includes an automated, highly integrated model-based design workflow optimized for Altera SoCs. Designers using this flow can accelerate