Archive

CadSoft EAGLE intros new simulation tool

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Felicitas uses EAGLE as front end in circuit simulation tool PCBSim for signal integrity tests

LPC MCU streamlines motor control

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NXP LPC1500 enables simultaneous control of two motors with a flexible, efficient design process

Artesyn announces new strategy for DC-DC products

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New product ranges will be available through the company’s global channel network or directly from Artesyn

Synopsys delivers industry’s fastest emulation system

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ZeBu Server-3 speeds hardware-software bring-up, OS boot and SoC verification by up to 4X for faster time-to-market on even the largest designs

TI intros first fully integrated logic gate device with up/down translation

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Widest voltage range logic translation devices reduce board space by more than 50 percent

VivaCell-MTS Armenia appoints Teclo Networks for high-speed mobile Internet

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Armenia’s leading mobile operator sees remarkable improvement through TCP/IP acceleration

Aricent and Octasic to intro high performance 3G and LTE small cell platforms

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OEM-ready joint solutions will help network equipment vendors to quickly build 3G and LTE Small Cell solutions to meet operators’ current and future requirements

Qualcomm demos LTE Advanced category 6 with Ericsson

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Qualcomm Gobi 9×35 modem enables peak download speeds of up to 300 Mbps, doubling previous generation’s speeds

Aricent develops high efficiency video codecs by leveraging ARM Mali GPU compute technology

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Aricent’s high efficiency video codecs (HEVC) helps silicon vendors quickly build 4K Ultra HD video solutions that consume considerably less power and bandwidth

University of Cambridge develops smart glass

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Coating, which could enable buildings to have antireflective self-cleaning windows

NA semicon equipment industry posts Jan. 2014 book-to-bill ratio of 1.04

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The three-month average of worldwide bookings in January 2014 was $1.28 billion

Connectem points to virtualization as solution to 4G/LTE network signaling storms

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Tests demonstrate capability of virtualized evolved packet core to manage signaling peaks over 90 percent more effectively

Plasma-Therm announces cross-licensing agreement with ON Semiconductor

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The agreement includes cross licensing of technology that offers semiconductor manufacturers production solutions that accelerate the manufacture of next-generation devices

Altair releases industry’s most advanced LTE chip

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Category 6 LTE-Advanced chipset supports 300Mbps throughput with 20+20MHz carrier aggregation

Metaio reveals augmented reality SDK to support latest 3-D camera and 3-D printing technologies

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This year’s Mobile World Congress arrives at the dawn of the 3-D camera

Leti CEO to discuss technologies enabling the Internet of Things

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It will be at Leti Days Grenoble 2014, June 25-26

Power module design for an ultra efficient three-level utility grid solar inverter

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Modules addressing the next generation solar inverter designs

BroadcastAsia2014 plays hub to OTT content revolution

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Event will feature experts from HBO Asia, MediaCorp, Samsung, StarHub, Tvinci, Telekom Malaysia and YouTube to provide essential knowledge and present case studies on OTT

Advanced batteries for utility-scale energy storage apps will surpass $2.5 billion by 2023

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Worldwide revenue from advanced batteries for utility-scale energy storage applications will grow from $164 million in 2014 to more than $2.5 billion in 2023

Bangalore Water taps IBM for Big Data analytics

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IBM helps Bangalore Water Supply and Sewerage Board manage complex water distribution systems