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Toshiba launches Photorelays in industry's smallest package

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Sharath Kumar
New Update

TOKYO, JAPAN: Toshiba Corporation today announced the launch of photorelays in the industry's smallest package.

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Shipment of mass production products starts from today.

The new products, "TLP3403" and "TLP3412", utilize the industry's smallest package for photocouplers, the Toshiba-developed VSON (Very Small Outline Non-leaded) package. Compared to equivalent Toshiba products in a USOP package, the new photorelays reduce the assembly area by 50pc and volume by 60 pc.

This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products.

Also, by using a new internal structure, a chip-on-chip structure<2>, the new products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The new photocouplers are suitable for various tester applications, especially for use in power-line switching and measuring-line switching.

 

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