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e-Shuttle partners with Hong Kong Tech Park

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CIOL Bureau
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BANGALORE,INDIA: Hong Kong Science and Technology Parks Corporation (HKSTP) and e-ShuttleInc. (ESI), a subsidiary of Fujitsu Microelectronics Limited (FML), today announced a partnership to provide silicon shuttle services for start-up integrated circuit (IC) design houses in Asia.

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The initiative is expected to provide first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost. The proprietary EBDW technology developed by e-Shuttle significantly lowers the cost of prototyping ICs and reduces turnaround time, said a press release.

As per the agreement HKSTP would provide development support, including design tools and evaluation systems and secured remote access design environment to design houses, which then send timing, power and other data to ESI for prototyping using the EBDW technology.

The program with e-Shuttle complements HKSTP’s IC Design Centre, which incorporates a wide range of IP services, including test development, IP trial, licensing, integration and verification – plus a legal framework for semiconductor intellectual property development under an ISO 27001 certified design environment, said the release.

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“Our co-operation with e-Shuttle will enable us to provide small and medium-sized technology developers with access to the most advanced prototyping technologies and FML’s superior wafer manufacturing,” said Ir. S.W. Cheung,’s vice president, Business Development and Technology Support, Hong Kong Science Park.

It would as well be a one-stop-shop service for design start and production release, governed by global best practices and the rule of IP protection laws of Hong Kong, he added.

Said Dr Haruo Tsuchikawa, president, e-Shuttle: "Working together with HKSTP we will activate new innovation by design houses in the semiconductor industry. HKSTP has the manufacturing support environment that start-ups need.”

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