SAN JOSE, CALIF.: Cypress Semiconductor Corp. introduced a high-speed USB 2.0 transceiver available in the industry's smallest package. The new MoBL-USB TX3LP18 transceiver is offered in a 20-pin WLCSP (Wafer Level Chip Scale Package) package that measures only 2.2 mm x 1.8 mm - almost three times smaller than a standard golf ball dimple. In addition to having a footprint 20 percent smaller than any competitive solutions, the device offers ultra-low power consumption. This combination saves board space and prolongs battery-life for a wide range of portable applications such as mobile handsets, PDAs, PMPs, and GPS units.

The MoBL-USB TX3LP18 transceiver is compliant with the UTMI (USB 2.0 Transceiver Macrocell Interface) + Low-Pin Interface (ULPI) standard. It delivers ultra-low power consumption with a 0.5 uA nominal sleep mode. In addition to its small size, the device integrates multiple passive components in order to further reduce boardspace usage and enable smaller end systems. It removes the need for a dedicated 3.3V power supply with a wide input supply voltage range from 3.0 to 5.8V, and features an integrated Phase-Locked Loop (PLL) to supply USB clocking requirements without a dedicated crystal.

"TX3 completes our portfolio of solutions for High-Speed USB support in portable applications," said Alakesh Chetia, managing director of Cypress's West Bridge Business Unit. "Between our TX2 and TX3 USB transceivers, FX2LP18 high-speed controllers, and full bridge solutions like West Bridge Antioch™, we are offering handheld system designers several solutions covering all possible performance needs. For multi-media handsets, high-speed USB is now a must, and Cypress can support any architecture."