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Semicon plastic packaging materials market to reach $20.2bn by 2011

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CIOL Bureau
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SAN JOSE, USA: The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.5 billion in 2007 and grow to $20.2 billion by 2011, according to a new study by SEMI and TechSearch International.

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Laminate substrates remain the largest segment of the market, worth an estimated $6.2 billion globally in 2007, and on a unit basis are projected to grow at a compound annual growth rate of over 12 percent over the next five years.

The report, titled “Global Semiconductor Packaging Materials Outlook- 2007/2008 Edition,” covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.

Semiconductor Packaging      Estimate of 2007

Materials Segment                 Global Market $M


Laminate Substrates                         6,196.0

Flex Circuit/Tape Substrates                262.5

Leadframes                                       3,118.0

Bonding Wire                                     3,178.3

Mold Compounds                               1,371.0

Underfill Materials                                 138.0

Liquid Encapsulants                             117.0

Die Attach Materials                             562.2

Solder Balls                                          265.0

Wafer Level Package Dielectrics               9.8

Thermal Interface Materials                  303.0

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The findings in the report are based on more than 125 in-depth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2007-2011), average selling price data and trends; and an analysis of regional market trends.

The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. Some of the key opportunities include:

* Reduced cost structures for standard laminate products;

* Thin core substrate materials with suitable properties to reduce warpage effects and improve handling;

* Alloy development to support on-going migration to smaller diameter gold bonding wire;

* Die attach materials and processes compatible with ultrathin wafer technologies;

* Resin materials that do not degrade moisture sensitivity levels and are compatible with low-k dielectrics and lead-free processing; and

* Underfill solutions for fine bump pitch and large die.

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