SEMI announces five new tech standards

SAN JOSE, USA: SEMI has published five new technical standards applicable to the semiconductor manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website.

SEMI Standards are published three times a year. The new standards, part of the November 2008 publication cycle, join more than 775 standards that have been published by SEMI during the past 35 years.

“These new SEMI standards, which include specifications to address counterfeiting of products in the semiconductor manufacturing supply chain, are the result of collaborative, consensus-driven efforts among industry experts,” said James Amano, Director, SEMI International Standards. “Their implementation will help manage the ever increasing manufacturing challenges, improve yield and ensure compatibility of equipment and processes worldwide.”

The full list of SEMI standards being released include:

SEMI E139.3: XML/SOAP Binding for Recipe and Parameter Management.

SEMI G87: Specification for Plastic Tape Frame for 300 mm Wafer.

SEMI M73: Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles.

SEMI M74: Specification for 450 mm Diameter Mechanical Handling Polished Wafers.

SEMI T20: System Architecture for Preventing/Detecting Semiconductor Counterfeit Products.

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS). About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees.

Source: SEMI, USA