It will resume production at the 200-mm wafer fabrication line on June 1 and at the cutting-edge 300-mm line on June 6.
The chip maker also said it expected its chip supplies to return to prequake levels by late July.
It will resume production at the 200-mm wafer fabrication line on June 1 and at the cutting-edge 300-mm line on June 6.
The chip maker also said it expected its chip supplies to return to prequake levels by late July.