Qualcomm tapes out first 45nm chip

SAN DIEGO, USA: Qualcomm Inc. announced that its first chip leveraging 45nm process technology has taped out. The next milestone in CMOS semiconductor manufacturing, 45nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration with reduced die cost by providing more die per wafer.

Behrooz Abdi, senior vice president and general manager for Qualcomm CDMA Technologies, said: "QUALCOMM's synergistic relationship with strategic foundry partners continues to support our long history of technology innovation as we reach this milestone in leading-edge process technology. We look forward to enabling new classes of products at 45 nanometers and beyond, which will evolve the role of wireless in everyday life to a new level for people around the world."

Qualcomm taped out its product on a low power-optimized 45nm process that utilizes advanced immersion lithography and very low k inter-metal dielectrics features. The technology

provides competitive performance with significant cost efficiency, along with improved performance on leakage and integration. It has also begun development work on 40nm process

technology, which is expected to deliver greater benefits in semiconductor performance, cost and efficiency.

Close collaboration with strategic technology and foundry partners is a key part of Qualcomm's integrated fabless manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.