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Philips India center to work on next-gen consumer chip

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CIOL Bureau
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BANGALORE: Philips Semiconductors, which has a 500-member strong team in India would be expanding its team's scope of work to include next generation consumer platform chip that would find applications in 3D TV and high-definition motion based enhancements.

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Speaking to the press, Penning de Vries, CTO, Philips Semiconductors, said that the chip would be ready next year. “We plan to work on designs in the latest technologies like 65 and 90 nm,” he said. He added that this would be their biggest chip.

In addition to this high-end design initiative, the company intends to increase its focus on reusable IP through a partnership with semiconductor design companies-Freescale Semiconductor and ST Microelectronics. Elaborating on this, Bart De Loore, the company's VP and GM, ReUse Technology Group said, “ We want to reuse our IP cores in different domains like consumer electronics, connectivity and mobile areas.” He is confident that the Bangalore center would play an important role in developing IP in this domain.

“By partnering together, we can widen the scope of work and jointly develop more products and improve time-to-market and costs,” he added.

De Vries also said that the company would continue to hire engineers at its Bangalore center for the next three years. However he did not reveal details of the headcount or investment.

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