Novellus delivers 5 percent lower keffective value

SAN JOSE, USA: In order for device performance to keep pace with Moore's Law, IC designers have had to drive node-to-node reductions in interconnect-related RC delay. Achieving this performance scaling has become increasingly challenging as interconnect spacing has decreased below 45nm.

Over the past several years, researchers have studied alternative materials and more complex integration schemes in order to meet the RC scaling challenge. While effective in a research environment, most of these materials and processes have faced challenges in terms of cost and production control when transferred to high volume manufacturing.

Employing recent breakthroughs in dielectric film deposition and interface control processes, Novellus has developed a technology package that delivers a 5 percent lower keffective value than alternative approaches, without the need for complex material changes.

These innovations in thin film deposition were achieved using the VECTOR PECVD system's multi-station sequential architecture. The development team optimized the parameters impacting each film and interface in the dielectric stack, enabling Novellus' customers to stay on track with technology scaling requirements.

"RC scaling is about keffective, not the absolute k value of each layer," said Mandyam Sriram, director of technology for Novellus' PECVD business unit. "Today the fastest and most advanced devices in the industry use Novellus dielectric films. We offer proven, high volume manufacturing-ready solutions to design-in capacitance reduction, with both an ease of integration and a low cost-of-ownership for our customers."