Nanoscale coatings may prevent semicon from heating

PORTLAND, USA: A recent study by researchers at the Pacific Northwest National Laboratory (PNNL) and Oregon State University (OSU) shows that Nanoscale coatings can improve the competence of semiconductors and other devices by eradicating the heat from the surface.

According to Terry Hendricks, the project leader at PNNL, the 10X improvement in heat transfer coefficient was observed for nanostructured surfaces over a 'bare' aluminum substrate and a 4X improvement in critical heat flux was measured for these nanostructured surfaces.

He performed the study with OSU professor Chih-hung Chang. The conclusion was that the nano-structured coatings transfer heat more efficiently. The researchers stated that coating techniques will help in the cooling of advanced lasers, radars, and power electronics devices in applications including high performance computers, advanced military avionics, electric vehicles and energy recovery systems.

The nanoscale coating method, dubbed micro reactor assisted nanomaterial deposition (MAND), deposited tiny grains of zinc oxide atop bulk aluminum and copper.

Experts at Oregon State University and the Pacific Northwest National Laboratory claimed that Nanoscale coating of zinc oxide on top of a copper plate boost heat transfer coefficient 10-times.

The exact process of heat reduction by MAND is still being investigated but it appears to be caused by higher-density nucleation sites and better capillary pumping action, which results in an improved heat-transfer surface-area per unit volume.

The researchers cited that, for forced liquid cooling systems using advanced micro channel architectures, their work exposes a critical tradeoff between nucleation site density, bubble frequency and bubble diameter that can be optimized for maximum heat dissipation.