Manufacturing innovations in MEMs, LEDs, silicon photonics, and printed/flexible electronicsAuthor : Chokkapan June 27, 2013 0
SAN FRANCISCO, USA: Recent advances in microelectronics technology and production processes have led to the rapid acceleration in MEMs and LED manufacturing, and breakthroughs in silicon photonics and printed/flexible electronics. What comes next?
The latest manufacturing, materials and production developments in all these technologies will be featured at SEMICON West 2013 (www.semiconwest.org), to be held at the Moscone Center in San Francisco, California, from July 9 to 11.
The co-location of LED, MEMS, silicon photonics, and printed/flexible electronics-focused exhibitors and technical presentations within the framework of SEMICON West is aimed at maximizing the synergies between semiconductors and related adjacent markets, as each shares many of the same manufacturing materials, equipment, and processes.
Over 200 exhibitors and nearly 20 hours of technical presentations will be focused on these adjacent markets, with leading manufacturers, experts and scientists in their respective fields.
Emerging and adjacent technology sessions at SEMICON West include:
Adding value in next generation MEMS – This session will address the critical challenges and barriers for MEMS as the market evolves from ‘one product – one process’ craftsmanship to high volume, more flexible manufacturing. Speakers from STMicroelectronics, Yole DÃ©veloppement, GLOBALFOUNDRIES, X-Fab, Texas Instruments, and Bodymedia will address the latest trends and developments.
MEMS and sensor packaging for the Internet of Things – The use of MEMS devices is exploding in volume and diversity. To meet this challenge, MEMs packaging and integration technologies will evolve to include controlled stress packaging, selective hermeticity, solutions for multiple sensors, and integrating intelligence and even energy supply and wireless transmission solutions. This session will feature keynote presentations by Janusz Bryzek, Ph.D., VP Development, MEMS and Sensing Solutions, Fairchild Semiconductor and Jiri Marek, Ph.D., senior VP of Engineering Sensors, Automotive Electronics Division, Robert Bosch.
Looking ahead to next generation of HB-LED manufacturing technology – Industry leaders will look at the current state of progress of some of the key developments that could potentially be disruptive, from alternative substrates and critical defect analysis to light extraction strategies and innovative packaging. Speakers from Yole, Bridgelux, Philips Lumileds, Azzurro Semiconductors, KLA-Tencor, and Seren Photonics will examine the latest breakthrough innovations.
Building an infrastructure for silicon photonics – We’ve invited a selection of leaders across the value chain – from the leading research labs to the key chip and systems makers – to talk about the current state of the technology, the likely solutions for integrating photonics with CMOS, and the industry ecosystem that will be needed to manufacture it, including experts from IBM, Cisco, Luxtera, Kotura, and Photonic Systems.
Integrating conventional silicon in flexible electronics – Some flexible electronics systems incorporate both printed electronics and silicon technology. This session, presented by SEMI’s partner FlexTech Alliance, will explore various techniques for creating very thin silicon chips that can be incorporated in flexible systems and finding ways to cost effectively and reliably integrate more conventional processors or MEMS sensors or high-speed RF communications with printed/flexible electronics systems. Speakers from American Semiconductor, Sandia National Labs, Jabil, Terapac, MC10, and Thin Film Electronics will examine the latest developments.
Emerging materials and processes for transparent conductors – This FlexTech Alliance workshop allows you to learn first-hand from materials and process experts about product and manufacturing requirements for transparent conductors in a range of applications. Material performance, manufacturing cost, and maturity are among the discussion topics. Speakers include: Applied Materials, Brewer Science, Cambrios Technologies, CareStream Health, FlexTech Alliance, Fujifilm Dimatix, Nanotech Biomachines, NovaCentrix, Touch Display Research, Sinovia Technologies, and Unipixel.