Kingston releases new modules using Intel chipsets

MUMBAI, INDIA:Kingston Technology Company, Inc., a provider in memory products, today announced the release of its first XMP-ready HyperX DDR3 SO-DIMMs for notebook PCs using Intel's Cantiga mobile chipset.

The 1066MHz CL5 Kingston ultra-low latency memory kits have passed Intel's XMP certification process and come pre-programmed with both JEDEC and XMP profiles, said a press release.

“Kingston worked closely with Intel to certify the new HyperX SO-DIMM memory for new DDR3 XMP-supported, Intel Centrino 2 Processor Technology systems,” said Erik Reid, director of Marketing for Intel's Mobile Platforms Group.

“We laud Kingston's efforts in the area of extreme mobile performance and expect that PC gamers will love the way XMP delivers next-generation notebook PCs with unrivaled performance.”

“The HyperX DDR3 XMP SO-DIMMs were tested on the Flextronics W840 DI notebook PCs with great success,” said Scott Chen, vice president of APAC Region, Kingston.

He added that the DDR3 notebook users could enjoy the same benefits such as lower latencies and voltages that enthusiasts and gamers have had for years with HyperX memory for desktop computers.

Kingston HyperX is backed by a lifetime warranty and free technical support, the release added.