Infineon leading the CoSiP project

CAMBRIDGE, UK: Infineon Technologies AG, based in Munich, Germany, has said that, in order to conduct research into an end-to-end SiP design environment, it is leading the CoSiP project with its partners.

The research partners of Infineon Technologies include the Fraunhofer Institute for Reliability and Microintegration (IZM), the automotive electronics division of Robert Bosch GmbH, the corporate technology division and healthcare sector of Siemens, and Amic Angewandte Micro-Messtechnik GmbH.

The project is co-funded by Germany’s Federal Ministry of Education and Research. It is scheduled to be completed by the end of 2012.

The 5 partners will, as a part of the CoSiP project, devise new design methods which would enable the components of SiP – two or more chips combined into a single chip package – to be developed together with the board on which the chip is mounted, allowing them to be adapted to suit it.

In a statement, Infineon Technologies said the partners of the project intend to create the foundations for the design tools required for the development of SiP.

The results of the CoSiP research project, according to Infineon Technologies, will help ensure optimal utilization of existing as well as future technologies for SiP applications.

While Siemens Healthcare and Siemens Corporate Technology plan to apply the results of the research in the area of medical technology, Bosch will make use of the results in the automotive industry.